Dupont Electronic Technology Co.
Telephone
Thermal mud
Thermal conductivity: 1~8W/mk
Status: Semi-solid
Function: used for gap filling
Specification packaging; 1kg/ 10kg/25kg
characteristic:
No sedimentation, room temperature storage
Superior high and low temperature resistance, excellent weather resistance
Radiation resistance and excellent dielectric properties
Superior chemical and mechanical stability
Low stress, low modulus thermally conductive products
Has the same plasticity as plasticine and is easy to fit
Product design with large variation in thickness requirements
Application side
power module
Integrated chip
power module
automotive electronics
controller
Telecommunications equipment
